Join Us at MIAC 2025!

Trimble Wedge is proud to sponsor MIAC 2025, the premier event for the paper and packaging industry in Italy. The conference will be held in Lucca from October 8 to 10, 2025.

Take the opportunity to connect with our process data analytics specialists, Matti Häkkinen, Holger Wagner, and Teemu Möykkylä, to explore how Wedge can enhance your process improvement efforts.